Taiwan Semiconductor Manufacturing Co executives said on Thursday that the world’s largest chipmaker will have the next version of ASML Holding NV’s most advanced chipmaking tool by 2024.

The tool called “high-NA EUV” produces beams of focused light that create the microscopic circuits on computer chips used in phones, laptops, cars and artificial intelligence devices such as smart speakers. EUV stands for extreme ultraviolet, the wavelength of light used by ASML’s most advanced machines.

“TSMC will introduce high NA EUV scanners in 2024 to develop the associated infrastructure and patterning solution customers need to drive innovation,” said YJ Mii, senior vice president of research and development, at TSMC’s technology symposium in Silicon valley.

Mii didn’t say when the device, the second generation of extreme ultraviolet lithography tools for making smaller and faster chips, would be mass-produced. TSMC rival Intel has said it will start using the machines in production by 2025 and will be the first to receive the machine.

With Intel making chips that other companies design, it will compete with TSMC for those customers.

Kevin Zhang, TSMC senior vice president of business development, clarified that TSMC would not be ready for production by 2024 with the new high NA EUV tool, but that it would mainly be used for research with partners.

“The importance of TSMC having it by 2024 means they get to the most advanced technology faster,” said Dan Hutcheson, TechInsights chip economist, who attended the symposium.

“High-NA EUV is the next big technology innovation that will put chip technology at the forefront,” said Hutcheson.

On Thursday, TSMC also provided more details about the technology for its 2nm chips, which it says are on track for volume production by 2025. TSMC said it has spent 15 years developing so-called “nanosheet” transistor technology to improve the speed and power. efficiency and will use it for the first time in its 2nm chips.

© Thomson Reuters 2022