Just weeks after announcing the first details of its upcoming Ryzen 7000 series desktop CPUs, AMD has released an overview of its roadmap for consumer and server products for the next two generations. The news comes from AMD’s Financial Analyst Day, when CEO Dr. Lisa Su spoke about the company’s plans to capture a portion of the projected $300 billion market for high-performance computing solutions. While the event is aimed at financial analysts and shareholders, the revelations about AMD’s competitive positions in various markets include information about emerging products. The company now also has a new slogan: “Together we go further”.

In the consumer market, AMD’s upcoming ‘Zen 4’ CPU core architecture will form the basis of the ‘Raphael’ generation of desktop CPUs, which will hit the market as the Ryzen 7000 series before the end of this year. This will be a high-end product line that uses a 5nm manufacturing process, and AMD promises an 8-10 percent improvement in IPC (instructions per clock) performance and at least a 25 percent improvement in terms of performance per watt. . 4nm versions are also planned, although it is not clear what the segmentation will be.

Zen 4 will also power the upcoming ‘Genoa’ line of Epyc server CPUs, as well as a new line of ‘Bergamo’ based on a density-optimized variant called Zen 4c for cloud-native computing applications. ‘Genoa-X’ variants will feature AMD’s integrated 3D V cache, a vertically stacked layer of high-speed memory on top of the CPU chip. Another product line codenamed ‘Siena’ will target a new market in intelligent edge and communications equipment.

After that, “Zen 5” is a major redesign slated for release in 2024 that should further improve performance and efficiency, and introduce new optimizations for AI and machine learning for Ryzen consumer CPUs codenamed “Granite Ridge.” These CPUs use 4nm and 3nm processes. The next Epyc generation will be codenamed “Turin” and should be released by the end of 2024.

AMD also confirmed that the next GPU microarchitecture, codenamed RDNA 3, will enable chiplet-based modular GPU design and use a 5nm manufacturing process. It is said to deliver a 50 percent increase in performance per Watt. A 4th-generation Infinity Architecture interconnection standard allows AMD to integrate third-party chiplets, enabling heterogeneous platforms and greater customizability for customers.

RDNA 3 will be featured in the next generation of ‘Navi 3’ discrete GPUs, which will be launched later this year as the next Radeon RX series products. This architecture will build on RDNA 2, which has been used by multiple game console manufacturers this generation, suggesting that the next generation will continue to use AMD’s hardware. RDNA 3 will also be integrated into upcoming ‘Phoenix Point’ mobile CPUs based on the Zen 4 architecture in 2023, with ‘Strix Point’ in 2024.

For professional markets, the CDNA 3 architecture and XDNA, the result of AMD’s acquisition of Xilinx, will contribute significant performance improvements for new products in the AI ​​and high-performance computing space. New Instinct MI300 accelerators for AI training and Alevo smart NICs for confidential computing are also expected to contribute to the company’s data center portfolio.

AMD sees growth in PC, console and cloud gaming, as well as interactive metaverse applications and 3D content creation. Xilinx IP will be integrated into all product lines to improve the performance of AI inference and training workloads for consumers and enterprises. The company is also working on a unified AI software roadmap to make the development of different products more cohesive.